Heat sink system with fin structure

ABSTRACT

A heat sink apparatus includes a heat conductive base plate and a plurality of fins in thermal communication with the heat conductive base plate. The plurality of fins is configured to form a plurality of curved and branching channels extending radially on the base plate. At least two of the plurality of fins are configured with a gap between them to trip a gas boundary layer formed on a first one of the at least two fins, when a gas boundary layer is present.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to heat fins, and particularly to heat sinks having a plurality of fins.

2. Description of the Related Art

Integrated circuits and printed circuit boards used in electronics increasingly require high-performance heat sinks that have a heat conducting base plate in thermal communication with a fin structure. Air introduced to the resulting system, often times using a forced-air cooling assembly such as a fan, accomplishes the thermal transfer by carrying away heat energy from the heat sink and fins. The air is directed either at the base plate (in an impinging air flow configuration) or over the base plate (in a parallel flow configuration) and channeled through the fins to carry away the heat. Typically, the fins are metallic and may employ a combination of different lengths and widths to optimize such thermal transfer characteristics.

Unfortunately, such fin and base-plate arrangements typically suffer from high pressure drop challenges resulting in increased fan size and increased fan input power requirements. In addition, the power dissipation requirements of electronic devices are increasing at a rapid pace, while their sizes continue to shrink to meet consumer demand. Conventional air-cooling methods are currently limited to thermal transfer power dissipation densities of 5-10 Watts/cm², while liquid cooling techniques that would allow greater power dissipation are expensive and may lower system reliability.

A need still exists, therefore, for an air-cooled heat sink with reduced pressure drop and increased thermal transfer characteristics.

SUMMARY OF THE INVENTION

A heat sink apparatus is disclosed for use with integrated circuits, printed circuit boards and other heat sources. In one embodiment, the heat sink includes a heat conductive base plate and a plurality of fins in thermal communication with the heat conductive base plate. The plurality of fins is configured to form a plurality of curved and branching channels extending radially on the base plate. At least two of the plurality of fins are configured with a gap between them to trip a gas boundary layer formed on a first one of the at least two fins, when a gas boundary layer is present.

In one embodiment of a method of cooling a heat conductive base plate, the method includes conducting heat from a heat conductive base plate to a plurality of curved fins, blowing air onto a face of the heat conductive base plate, directing the air through first-tier channels established by the plurality of curved fins to induce primary and vortex flow patterns, directing the air through second-tier branching channels formed by the plurality of curved fins to reduce buildup of back pressure as the air moves across the heat conductive base plate adjacent to the curved fins and passing the air across gaps formed in the plurality of curved fins to trip a developing thermal boundary layer.

BRIEF DESCRIPTION OF THE DRAWINGS

The components in the figures are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the invention. Like reference numerals designate corresponding parts throughout the different views.

FIG. 1 is a perspective view of a heat sink that has, in one embodiment, a fin structure forming curved and branching channels extending radially on a heat conductive base plate;

FIG. 2 is a top plan view of one embodiment of a fin structure for use in a heat sink.

FIG. 3 is a perspective view of the embodiment shown in FIG. 1 that has a forced-air fan positioned on top of the fin structure;

FIG. 4 is a cross-sectional view of the embodiment shown in FIG. 2 along the line 4-4 illustrating primary and secondary gas flow forming a vortex pattern;

FIGS. 5 a and 5 b are perspective and enlarged views, respectively, of a heat sink that has fins comprising a plurality of pin fins;

FIG. 6 is a perspective view of, in one embodiment, a heat sink that has a plurality of fins arranged in a parallel flow configuration;

FIG. 7 is a perspective view of the embodiment shown in FIG. 5, illustrating a metering port positioned between the plurality of fins and a forced-air fan;

FIG. 8 illustrates, in one embodiment, dimples formed on a heat conductive base plate to trip thermal and velocity boundary layers on a heat sink that uses a fin structure.

FIG. 9 is a flow diagram illustrating one embodiment of a heat sink method that uses branching and curved fins primary and vortex flow patterns while using gaps in such fins to trip a developing thermal boundary layer.

DETAILED DESCRIPTION OF THE INVENTION

A heat sink, in accordance with one embodiment, includes a plurality of heat conducting fins coupled to a heat conductive base plate, with the fins arranged to form curved and branching channels that extend radially on the base plate. The fins are curved to produce primary and secondary flow characteristics when air is forced through them to provide advantageous thermal transfer characteristics between the air, fins and base plate. Each transition to a new tier of branching channels also results in development of a new thermal boundary layer to provide advantageous thermal transfer characteristics. Each subsequent tier of branching channel has a reduced cross section area for a reduced gas flow rate through such channel. The number of tiers of branching channels is preferably four or higher, but may be designed based on heat load requirement and available fan size. In the preferred embodiment, the adjoining and discontinuous fins are also configured with a gap between them to trip flow and thermal boundary layers to further improve thermal transfer characteristics. Although the preferred embodiment is described for use with gas, it is contemplated that the apparatus may also be used in a liquid environment to form a liquid-cooled heat exchanger. The curved fins, multi-scale branching channels and fin gaps provide a heat sink with reduced back pressure and increased thermal transfer characteristics verses previous heat sink designs allowing the use of smaller fans (in an air-cooled format) for the same heat transfer coefficient and improving overall system reliability.

FIG. 1 illustrates a heat sink 100, preferably an air-cooled heat sink, designed to work with a forced-air fan that blows air in an impinging manner onto its face. Although the following system is described for use with air, it is understood that the term “air” encompasses any number of gases including atmospheric air, nitrogen, helium or any of the noble gases. A plurality of fins 105 are arranged in a radially extending formation on a heat conducting base plate 107. The heat conducting base plate 107 is preferably solid and formed from metal such as copper, although other metals or composite materials may be used, such as aluminum, stainless steel or nickel. The fins 105 are preferably metal that are either cast on the heat conductive base plate 107 for good thermal connection, or manufactured separately and coupled to the base plate 107 using a soldering or brazing technique for good thermal connection with the base plate 107. Similar to the base plate 107, the material of fins 105 is preferably copper, although other metals or composite materials may be used such as aluminum, stainless steel or nickel. Alternatively, the base plate 107 and fins 105 may each be formed from other heat conducting materials, such as silicon, and provided with a suitable thermal coupling to the heat conducting base plate 107. Although the fins are preferably formed from the same material, different materials may be used to suitably modify thermal conductivity and consequent uniformity of base plate temperature. Spacing between adjacent fins 105 is preferably between 1 mm and 10 mm. The height H of each fin is preferably constant and is dictated by the spacing (b) between adjacent fins 105. The aspect ratio, defined as H/b, is preferably 1-5, but may approach 10 before advantageous secondary air flow characteristics (see below) are disrupted. In an alternative embodiment, fin height H increases radially outward from the center of the heat sink to promote greater air flow over the base plate 107 for more uniformity of base plate temperature and to lower the pressure drop. In one heat sink designed to receive approximately 2-23 Kg/hour of blown air, the base plate is preferably square and has a length L of approximately 5-25 cm and a width W of approximately 5-25 cm. The thickness of each fin is approximately 1-2 mm. In an alternative embodiment, the fins may be miniaturized to make form a micro-scale heat sink.

FIG. 2 illustrates a top plan view of one embodiment of a fin structure for use with a heat sink 200. In the embodiments illustrated in FIGS. 1 and 2, the fins 105 are splayed radially outward from an interior region 202 of the base plate. The fins 105 are configured in a repeating and multi-tiered branching pattern, one example of such illustrated in region 204. First and second curved fins (206, 208) form a first channel inlet 210 at proximal ends abutting the interior region 202 to receive a flow of air. This first channel is referred to herein as a first-tier branch channel 211. A third curved fin 212 is positioned between the first and second curved fins (206, 208) with a proximal end 214 of the third curved fin 212 set back from the first channel inlet 210 to establish a second channel inlet 216 leading to a second-tier branch channel 217. This second-tier branch 217 receives a portion of the air flowing through the first-tier branch channel 211. Preferably, a fourth curved fin 218 is positioned between the first and third curved fins (206, 212), with a fourth curved fin proximal end 220 set back from the second channel inlet 216 to establish a third channel inlet 222 leading to a third-tier branch channel 223. Additional fins may be provided (indicated as dash-lined fins) between pairs of each curved fin (206, 208, 212, 219) to provide additional-tiered branch channels. Each curved fin (206, 208, 212, 218) is preferably configured with one or more gaps 224 along their lengths to trip respective developing thermal and velocity boundary layers to improve thermal transfer between the respective fins and air flow (or fluid, if used in a fluid system) moving across their surfaces. The gaps preferably extend up and perpendicular from the base plate with a length equal to the height H of each fin. In an alternative embodiment, the gaps extend only a portion of the height H of each fin or along a different vertical portion of each fin. An increase in the width and/or length of the gap would increase tripping effects on the respective boundary layers, while a reduction in the width and/or length of the gap would reduce tripping effects of the respective boundary layers.

The described repeating and multi-tiered branching pattern 204 preferably repeats about the periphery of the heat sink 200 to provide a heat sink with reduced back pressure and increased thermal transfer characteristics verses previous heat sink designs. In an alternative embodiment, the relative lengths and relative positions of the curved fins in other sectors of the heat sink are changed to modify flow characteristics according to the fins' use in a fan or fluid system to properly distribute heat energy absorbed from the heat conducting base plate 107.

During operation, the heat conductive base plate 107 is in thermal communication with a heat source such as an operating integrated circuit or printed circuit board to absorb dissipated heat energy. Dissipated heat energy is conducted from the conductive base plate to the plurality of curved fins 105 positioned radially across the base plate 107 to improve the heat removal capacity of the heat sink system. Air is blown directly onto the face of the conductive base plate (impinging air flow configuration). Air is directed in a primary flow pattern through channels (211, 217, 223) formed by the curved fins, with the curvature of the fins inducing a secondary flow pattern. Branching channels formed by the curved fins reduce buildup of back pressure as the air moves across the heat conductive base plate adjacent to the curved fins. Developing thermal and velocity boundary layers are repeatedly tripped by passing the air across gaps formed between the plurality of curved fins.

FIG. 3 illustrates a heat sink that has a forced-air fan assembly positioned on top of the fin structure, first illustrated in FIG. 1, to establish an impinging air flow heat sink structure. An air flow directing port 300 is positioned between a forced-air fan assembly 302 and the fins 105 to direct air drawn through the fan 302 to impinge directly on the base plate 107 and through the fins 105. The fan 302 may be connected to the directing port 300 and fin/base plate (105, 107) by any suitable means, such as with a threaded bolts or an adhesive or soldering coupling (not shown). The fan 302 and directing port 300 are configured to maximize the flow of air through the fins 105 to achieve improved heat transfer between heat conductive base plate 107, fins 105 and flow of air provided by the fan 302.

FIG. 4 is a cross-sectional view along the line 4-4 in FIG. 2 illustrating primary and secondary air flow patterns. Impinging air flow 400 is directed from the forced-air fan (See FIG. 3) to impinge upon the base plate 107. A substantial portion of the air flow 400 is directed between first and second curved fins (206, 208). As the air flow 400 is directed by the curved fins (206, 208), secondary flow develops in a vortex pattern 402 to increase thermal transport between the air 400, base plate 107 and curved fins (206, 208). Each gap 224 also serves to trip developing thermal and velocity boundary layers adjacent the curved fins (206, 208) and base plate 107. Although curved fins (206, 208) are illustrated having a uniform height H, as described above for FIG. 2, they may each be of increasing heights to lower the pressure drop and to better insure the primary and secondary flow remains between the curved fins (206, 208).

FIGS. 5 a and 5 b illustrate one embodiment of a heat sink 500 that has fins comprised of pin fins. In this embodiment of an air-cooled heat sink, designed to work with a forced-air fan for direct impinging of air on base plate 107, a plurality of fins 502 are arranged in a radially extending and branching formation on the heat conducting base plate 107. Each individual curved fin 502 is comprised of individual pin fins 504 to provide a greater surface area to volume ratio for better system thermal performance. The pin fin configuration also allows more stagnation area of the impinging air flow on the heat sink base plate 107 for a higher local heat transfer coefficient. In the embodiment illustrated in FIG. 5a, primary flow (not shown) is induced between adjacent fins 502 and is induced between adjacent pin fins 504. The flow of air past the pin fins 504 also results in a constantly developing thermal boundary layer as the boundary layer is repeatedly tripped by the pin fins 504. The pin fins 504 are preferably formed from metal such as copper, although other materials may be used, such as aluminum, stainless steel or nickel. As in the embodiment illustrated in FIG. 1, the pin fins 504 are cast on the heat conductive base plate 107 for good thermal connection, or may be manufactured separately and coupled to the base plate 107 using a soldering or brazing technique for good thermal connection with the base plate 107. The height H of each pin fin 504 is preferably constant, although pin height may vary by increasing radially outward from the center of the heat sink to provide more uniformity of base plate temperature.

FIG. 6 illustrates one embodiment of a heat sink that has a radially-extending and branching fin structure configured for a parallel flow configuration across a base plate face 601. The plurality of fins 105 are arranged and splayed in a repeating and multi-tiered branching pattern, one example of such illustrated in region 602. Unlike in FIGS. 1 and 2, the plurality of fins 105 are configured in generally concentric configurations on the heat conducting base plate 107 to receive air directed at a leading edge 603 of the base plate 107, with at least one focus at one corner 604 of the heat conductive base plate 107. First and second channel inlets (605, 606) are formed by the fins 105 adjacent the leading edge 603, leading to respective first-tier branch channels 610, 612. In the example region 602, successive tiers of branch channels are defined by fins formed in concentric circles about the focus 604 and set back from the first and second channel inlets (605, 606). Each curved fin 105 is preferably configured with one or more gaps 224 along their lengths to trip respective developing thermal and velocity boundary layers formed when air is introduced across them to promote advantageous thermal transfer characteristics. The gaps 224 preferably extend up and perpendicular from the base plate with a length equal to the height H of each fin or may extend along only a portion of the height H of each fin or along a different vertical portion of each fin.

FIG. 7 illustrates a heat sink that has a forced-air fan assembly positioned adjacent the fin structure along a leading edge of the heat conductive base plate 107, to establish a parallel flow heat sink structure. An air flow metering port 700 is positioned between a forced-air fan assembly 702 and the fins 105 to induce air drawn through the fan 702 to flow along the upper surface 601 of the base plate 107. The fan assembly 702 may be connected to the metering port 700 and fin/base plate (105, 700) with threaded bolts (not shown), or by any suitable means. The fan assembly 702 and metering port 700 are configured in complementary opposition to maximize the flow of air over the face 601 of the base plate and through the fins 105.

In FIG. 8, one embodiment of a base plate 800 has concave dimples formed on its upper surface 802 for generating vortices in between the fins. Concave dimples 804 are spaced apart and positioned on a surface 802 of base plate 800 between fins 105. The concave dimples 804 preferably have an approximate depth of 100 μm-1 mm and width of and 100 μm-1 mm and are preferably spaced apart by approximately 5-20 mm. During operation, as primary air flow 400 is introduced over the surface of the conductive base plate 800, vortex 806 is generated, thereby promoting advantageous thermal transfer between the base plate 800 and air flow. In an alternative embodiment, the dimples 804 are formed either solely on fins 105 or on both the fins 105 and base plate face 802.

FIG. 9 illustrates operation of one embodiment of a heat sink that uses branching and curved fins with gaps in such fins that are used to trip a developing thermal boundary layer. Air is blown onto a face of the base plate 900 and heat is conducted from the base plate to a plurality of curved fins. 905. The blown air is directed through at least one first-tier channel established between the curved fins 910 that are themselves sized and configured to induce primary and secondary flow patterns for advantageous thermal transfer characteristics between the blown air and fins. A portion of the air is directed through a plurality of second-tier branching channels established by the plurality of curved fins 915 to reduce the build-up of back pressure as the air moves across the heat conductive base plate adjacent to the curved fins. The air flowing through the curved fins is passed across gaps formed in the curved fins to trip a developing thermal boundary layer 920. In an alternative embodiment, the air is also passed across concave dimples either formed on a surface of the heat conductive base plate 925 or on at least one of the plurality of curved fins 930 (or both) to further trip any developing thermal boundary layer.

While various implementations of the application have been described, it will be apparent to those of ordinary skill in the art that many more embodiments and implementations are possible that are within the scope of this invention. 

1. A heat sink apparatus, comprising: a heat conductive base plate; and a plurality of fins in thermal communication with said heat conductive base plate, said plurality of fins configured to form a plurality of curved and branching channels extending radially on said base plate, at least two of said plurality of fins configured with a gap between them to trip a boundary layer formed on a first one of said at least two fins, when a boundary layer is present.
 2. The apparatus of claim 1, wherein at least one of said plurality of fins comprises a plurality of pin fins.
 3. The apparatus of claim 1, wherein said plurality of fins have respective fin heights that increase radially outward to provide a more uniform base plate temperature when used as a heat sink.
 4. The apparatus of claim 1, wherein said gap extends substantially across the height of said at least one of said plurality of fins.
 5. The apparatus of claim 1, further comprising a plurality of concave dimples configured on an upper surface of said heat conductive based plate to introduce a vortex flow on the said upper surface, when a flow is present.
 6. A heat sink apparatus, comprising: a heat conductive base plate; first and second curved fins in thermal communication with said heat conductive base plate, said first and second curved fins forming a first channel inlet to receive a flow of gas for heat transfer; a third curved fin positioned between said first and second curved fins and extending from a position on said heat conductive base plate set back from said first channel inlet, said first curved fin and a proximal end of said third curved fin establishing a second channel inlet to receive a portion of the flow of gas for heat transfer; and a fourth curved fin positioned between said first and third curved fins and extending from a position on said heat conductive base plate set back from said second channel inlet, said first curved fin and a proximal end of said fourth curved fin forming a third channel inlet to receive a portion of the flow of gas for heat transfer; wherein said first, second, third and fourth fins establish a plurality of branching and curved channels to receive a gas flow and to induce primary and secondary gas flow for increased heat transfer at a reduced pressure drop between said first and third channel inlets.
 7. The apparatus of claim 6, further comprising: a fifth curved fin positioned between said first and fourth curved fins and extending from a position on said heat conductive base plate set back from said third channel inlet, said first curved fin and a proximal end of said fifth curved fin forming a fourth channel inlet to receive a portion of the flow of gas for heat transfer at a reduced pressure drop between said first and fourth channel inlets.
 8. The apparatus of claim 6, wherein at least one of said first, second and third curved fins comprises a plurality of fin segments to trip a gas boundary layer at each respective fin gap.
 9. The apparatus of claim 6, wherein at least one of said first, second and third curved fins comprises a plurality of pin fins to trip a gas boundary layer at each respective pin gap.
 10. The apparatus of claim 6, wherein at least one of said first, second and third curved fins have a fin height that increases radially outward to provide more uniformity of base plate temperature.
 11. The apparatus of claim 10, further comprising a plurality of concave dimples configured on an upper surface of said heat conductive based plate to introduce a vortex flow on the said upper surface, when a flow is present.
 12. A heat sink system, comprising: a heat conductive base plate; a fin structure in thermal communication with said base plate, said fin structure having a plurality of curved branching channels, said plurality of curved branching channels having a first tier channel inlet; a fan positioned in complementary opposition to said first tier channel inlet to provide a flow of air.
 13. The system of claim 12, further comprising a metering port positioned between said first tier channel inlet and said fan to redirect air towards said first tier channel inlet.
 14. The system of claim 12, further comprising a directing port positioned between said first tier channel inlet and said fan to redirect air towards said first tier channel inlet.
 15. The system of claim 12, wherein said curved branching channels comprise a plurality of curved fins.
 16. The system of claim 15, wherein at least one of said curved fins comprises a plurality of fin segments to trip a gas boundary layer at each respective fin segment intersection.
 17. The system of claim 15, wherein at least one of said curved fins comprises a plurality of pins to trip a gas boundary layer at each respective pin intersection.
 18. The apparatus of claim 15, further comprising a plurality of concave dimples configured on an upper surface of said heat conductive based plate to introduce a vortex flow on the said upper surface, when a flow is present.
 19. A method of cooling a heat conductive base plate, including: conducting heat from a heat conductive base plate to a plurality of curved fins; blowing air onto a face of said heat conductive base plate; directing said air through at least one first-tier channel established by said plurality of curved fins to induce primary and vortex flow patterns; directing said air through a plurality of second-tier branching channels established by said plurality of curved fins to reduce buildup of back pressure as said air moves across said heat conductive base plate adjacent to said curved fins; and passing said air across gaps formed in said plurality of curved fins to trip a developing thermal boundary layer.
 20. The method of claim 19, further comprising: passing said air across concave dimples formed on a surface of said heat conductive base plate to trip a developing thermal boundary layer.
 21. The method of claim 19, further comprising: passing said air across a plurality of concave dimples formed on at least one of said plurality of curved fins to trip a developing thermal boundary layer. 